The present article experimentally investigates the thermal performance of the vapor chamber module. Vapor chamber utilizes boiling-condensation mechanism to achieve high heat transfer capability and heat spreading performance. The influences of heating power and fill-ratio of working fluid to the thermal performance are investigated. In the results, the device performs better at high heating power. The best fill-ratio for the vapor chamber is 30%, with which the vapor chamber resistance reaches the best performance of 0.1℃/W at 140W.
