蒸氣腔體熱傳性能之研究

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Title:	蒸氣腔體熱傳性能之研究
Other Titles:	Experimental Investigation of Vapor Chamber
Authors:	江沅晉
Contributors:	機械系
Keywords:	蒸氣腔體熱傳性能沸騰冷凝
Date:	2007-06
Issue Date:	2010-06-10
Abstract:	本研究主要以實驗方法針對蒸氣腔體散熱模組熱傳性能進行研究，蒸氣腔體藉由內部工作流體沸騰與冷凝之相變化熱傳機制進行熱傳遞，所以具有較佳的熱傳性能與熱擴散能力，本研究中實驗參數包含各種不同加熱功率與工作流體填充量，實驗結果顯示蒸氣腔體在高加熱功率下會有一較佳的熱傳性能，就本實驗而言，工作流體最佳填充量為30%，當加熱功率為140W，工作流體填充量為30%時，本實驗的蒸氣腔體會有一最佳性能，此時熱阻值為0.1℃/W。 The present article experimentally investigates the thermal performance of the vapor chamber module. Vapor chamber utilizes boiling-condensation mechanism to achieve high heat transfer capability and heat spreading performance. The influences of heating power and fill-ratio of working fluid to the thermal performance are investigated. In the results, the device performs better at high heating power. The best fill-ratio for the vapor chamber is 30%, with which the vapor chamber resistance reaches the best performance of 0.1℃/W at 140W.
Relation:	華岡工程學報 21期 P.69-76
Appears in Collections:	[College of Engineering] Chinese Culture University Hwa Kang Journal of Engineering

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