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https://irlib.pccu.edu.tw/handle/987654321/30870
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| 題名: | The Microstructures and Electrical Resistivity of (Al, Cr, Ti)FeCoNiOx High-Entropy Alloy Oxide Thin Films |
| 作者: | Tsau, Chun-Huei
Hwang, Zhang-Yan
Chen, Swe-Kai |
| 貢獻者: | Grad Sch Nanomat |
| 關鍵詞: | MECHANICAL-BEHAVIOR
ELEMENTS |
| 日期: | 2015 |
| 上傳時間: | 2015-11-03 16:31:03 (UTC+8) |
| 摘要: | The (Al, Cr, Ti)FeCoNi alloy thin films were deposited by PVD and using the equimolar targets with same compositions from the concept of high-entropy alloys. The thin films became metal oxide films after annealing at vacuum furnace for a period; and the resistivity of these thin films decreased sharply. After optimum annealing treatment, the lowest resistivity of the FeCoNiOx, CrFeCoNiOx, AlFeCoNiOx, and TiFeCoNiOx films was 22, 42, 18, and 35 mu Omega-cm, respectively. This value is close to that of most of the metallic alloys. This phenomenon was caused by delaminating of the alloy oxide thin films because the oxidation was from the surfaces of the thin films. The low resistivity of these oxide films was contributed to the nonfully oxidized elements in the bottom layers and also vanishing of the defects during annealing. |
| 關聯: | ADVANCES IN MATERIALS SCIENCE AND ENGINEERING, Volume 2015 (2015), Article ID 353140, 6 pages |
| 顯示於類別: | [化學工程與材料工程學系暨碩士班] 期刊論文
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