Impacts of mold material and pattern size for ultrasonic nanoimprint lithography

文化大學機構典藏 CCUR > 理工學院 > 工學院 > 機械工程系暨機械工程學系數位機電研究所 > 期刊論文 > Item 987654321/24179

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题名:	Impacts of mold material and pattern size for ultrasonic nanoimprint lithography
作者:	Tseng, PY (Tseng, Po-Yuan) Lin, CH (Lin, Chien-Hung)
贡献者:	Dept Mech Engn
关键词:	Nanofabrication Ultrasonic nanoimprint Nickel mold Silicon mold
日期:	2012-10
上传时间:	2013-02-19 14:19:03 (UTC+8)
摘要:	The ultrasonic nanoimprint lithography (U-NIL) was proposed to overcome the drawbacks of long process time comparing with conventional NIL methods. However, the impacts of mold material and pattern size have not been systematically investigated for U-NIL Therefore, it is necessary to study on the optimum process parameters to get good replicated structures during imprinting process. In this paper, we fabricated three types of the mold with different materials and line widths, then demonstrated the replicated sub-micrometer and micrometer scales structures on poly(ethylene terephthalate) (PET) in heating-assisted ultrasonic nanoimprint. Using the filling ratio as imprinting quality, the results of Taguchi's orthogonal array experimental layout could determine the optimum process parameters as the best setting. From experiments, temperature is the most effective factor of different line width molds, and imprinting force is the most significant factor between different materials. These would provide to advance U-NIL to set imprinting conditions, and to achieve good replication with high throughput and low cost. (C) 2012 Elsevier B.V. All rights reserved.
關聯:	MICROELECTRONIC ENGINEERING 卷: 98 頁數: 112-116
显示于类别:	[機械工程系暨機械工程學系數位機電研究所] 期刊論文

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