文化大學機構典藏 CCUR:Item 987654321/24082
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    Please use this identifier to cite or link to this item: https://irlib.pccu.edu.tw/handle/987654321/24082


    Title: Bias voltage effect on the structure and property of the (Ti:Cu)-DLC films fabricated by cathodic arc plasma
    Authors: o, JY (Jao, Jui-Yun)
    Han, S (Han, Sheng)
    Yen, CC (Yen, Chung-Chih)
    Liu, YC (Liu, Yu-Ching)
    Chang, LS (Chang, Li-Shin)
    Chang, CL (Chang, Chi-Lung)
    Shih, HC (Shih, Han-C.)
    Contributors: Dept Mat Sci & Engn
    Keywords: Transmission electron microscope
    Diamond-like carbon
    Cathodic arc evaporation
    Date: 2011-02
    Issue Date: 2013-01-25 10:52:41 (UTC+8)
    Abstract: Titanium copper-diamond-like carbon (Ti:Cu)-DLC films were deposited onto silicon via cathodic arc evaporation process using titanium (Ti) and copper (Cu) target arc sources to provide Ti and Cu in the metal containing diamond-like carbon (Me-DLC) film systen. Acetylene reactive gases served as the carbon sources, which were activated at 180 degrees C at 20 mTorr. Varying substrate bias voltages from -80 to -250 V were used in order to provide the (Ti:Cu)-DLC structure. The structure, interface, and mechanical properties of the produced film were analyzed by transmission electron microscope (TEM), IR Fourier transform (FTIR) spectra, and Rockwell C hardness. The process parameters were compared by studying the various mechanical properties of the films, such as microhardness and adhesion. The results showed that the Ti-containing a-C:H/Cu coatings exhibited an amorphous layer of Ti-DLC layer as well as a nanocrystalline layer of Cu multilayer structure. The mechanical properties of the coatings, as determined by Rockwell C indents testing and the ball-on-disc test. varied with the the applied negative DC bias voltage. These (Ti:Cu)-DLC coatings are promising materials for soft substrate protective coatings. Crown Copyright (C) 2010 Published by Elsevier B.V. All rights reserved.
    Relation: DIAMOND AND RELATED MATERIALS 卷: 20 期: 2 頁數: 123-129
    Appears in Collections:[化學工程與材料工程學系暨碩士班] 期刊論文

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