Bias voltage effect on the structure and property of the (Ti:Cu)-DLC films fabricated by cathodic arc plasma

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Title:	Bias voltage effect on the structure and property of the (Ti:Cu)-DLC films fabricated by cathodic arc plasma
Authors:	o, JY (Jao, Jui-Yun) Han, S (Han, Sheng) Yen, CC (Yen, Chung-Chih) Liu, YC (Liu, Yu-Ching) Chang, LS (Chang, Li-Shin) Chang, CL (Chang, Chi-Lung) Shih, HC (Shih, Han-C.)
Contributors:	Dept Mat Sci & Engn
Keywords:	Transmission electron microscope Diamond-like carbon Cathodic arc evaporation
Date:	2011-02
Issue Date:	2013-01-25 10:52:41 (UTC+8)
Abstract:	Titanium copper-diamond-like carbon (Ti:Cu)-DLC films were deposited onto silicon via cathodic arc evaporation process using titanium (Ti) and copper (Cu) target arc sources to provide Ti and Cu in the metal containing diamond-like carbon (Me-DLC) film systen. Acetylene reactive gases served as the carbon sources, which were activated at 180 degrees C at 20 mTorr. Varying substrate bias voltages from -80 to -250 V were used in order to provide the (Ti:Cu)-DLC structure. The structure, interface, and mechanical properties of the produced film were analyzed by transmission electron microscope (TEM), IR Fourier transform (FTIR) spectra, and Rockwell C hardness. The process parameters were compared by studying the various mechanical properties of the films, such as microhardness and adhesion. The results showed that the Ti-containing a-C:H/Cu coatings exhibited an amorphous layer of Ti-DLC layer as well as a nanocrystalline layer of Cu multilayer structure. The mechanical properties of the coatings, as determined by Rockwell C indents testing and the ball-on-disc test. varied with the the applied negative DC bias voltage. These (Ti:Cu)-DLC coatings are promising materials for soft substrate protective coatings. Crown Copyright (C) 2010 Published by Elsevier B.V. All rights reserved.
Relation:	DIAMOND AND RELATED MATERIALS 卷: 20 期: 2 頁數: 123-129
Appears in Collections:	[Department of Chemical & Materials Engineering] journal articles

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