In this study, the industry-university cooperation Starconn company provides an AMC (Advanced Mezzanine Card) connector which failed to meet the impedance specifications. The present paper undertakes the high frequency optimization analysis to solve the impedance mismatch problem for AMC connectors. First, the CST simulation analysis capability is established and the accuracy of the CST simulation is verified by the comparison between the simulated results and the actual measured data. Next, by using CST simulation analysis, the parameters of connector pin width, connector corner geometry and pin lay-out are identified to perform the optimization process to improve the characteristic impedance of AMC connector, and provides a final design of AMC connector with the compliance requirements of high frequency specifications.
Experimental measurement cannot rely solely on the connector body, the connector must be inserted on PCB Board and, then, the experimental data can be measured. After the connector design is completed, the specific test PCB board is designed, analyzed and developed in order to reduce the effect of PCB board for high frequency measurements and allowing measurements to show actual high-frequency performance of the connector.
In this study, the photo types of the optimized AMC high frequency connector and test PCB board is produced through industry-university cooperation Starconn company. After the actual test, the product not only meets the specification in the characteristic impedance, but also shows good results in the S-parameters, the difference between loss and return loss. The certification for AMC high frequency connector will be continued in the future.
