文化大學機構典藏 CCUR:Item 987654321/23907
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    Please use this identifier to cite or link to this item: https://irlib.pccu.edu.tw/handle/987654321/23907


    Title: 電子連接器與PCB板組立高頻優化分析與驗證
    Authors: 吳育杰
    Contributors: 數位機電科技研究所
    Keywords: AMC高頻連接器
    AMC High-frequency Connector
    PCB板
    PCB
    阻抗匹配
    Impedance matching
    CST
    Date: 2012
    Issue Date: 2012-12-06 11:29:05 (UTC+8)
    Abstract: 本研究針對產學合作廠商慶良電子公司所提供的一阻抗未達規範之AMC(Advanced Mezzanine Card)連接器,進行AMC連接器高頻優化分析來改善阻抗不匹配之情形,首先建立CST模擬分析的能力並以實際量測數據的比對來驗證本CST模擬分析的準確性。然後利用CST模擬分析,針對連接器端子寬窄、彎角、子卡夾頭造型與佈線等參數進行優化分析來改善AMC連接器之特性阻抗,最後提出符合規範要求的AMC高頻連接器。
      實驗的量測無法單靠連接器本體進行,必須藉由PCB板才可量測,然而為降低PCB板對高頻量測數據的影響,所以連接器設計完成,為展現連接器該有的高頻特性。本研究也進行AMC高頻連接器專用測試板之設計、優化分析與開發,讓量測數據能夠顯現出連接器的實際高頻性能。
      最後,本研究提出優化後的AMC高頻連接器及測試PCB板設計樣式,透過產學合作廠商慶良電子公司製造出實際樣品,進行實測比對,結果樣品除了在特性阻抗到達規範外,其餘在S參數、差損和回損上也能得到良好的表現。後續也將進行AMC高頻連接器的高頻認證工作。

    In this study, the industry-university cooperation Starconn company provides an AMC (Advanced Mezzanine Card) connector which failed to meet the impedance specifications. The present paper undertakes the high frequency optimization analysis to solve the impedance mismatch problem for AMC connectors. First, the CST simulation analysis capability is established and the accuracy of the CST simulation is verified by the comparison between the simulated results and the actual measured data. Next, by using CST simulation analysis, the parameters of connector pin width, connector corner geometry and pin lay-out are identified to perform the optimization process to improve the characteristic impedance of AMC connector, and provides a final design of AMC connector with the compliance requirements of high frequency specifications.
      Experimental measurement cannot rely solely on the connector body, the connector must be inserted on PCB Board and, then, the experimental data can be measured. After the connector design is completed, the specific test PCB board is designed, analyzed and developed in order to reduce the effect of PCB board for high frequency measurements and allowing measurements to show actual high-frequency performance of the connector.
    In this study, the photo types of the optimized AMC high frequency connector and test PCB board is produced through industry-university cooperation Starconn company. After the actual test, the product not only meets the specification in the characteristic impedance, but also shows good results in the S-parameters, the difference between loss and return loss. The certification for AMC high frequency connector will be continued in the future.
    Appears in Collections:[Department of Mechanical Engineering ] thesis

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