This article experimentally investigates the thermal performance of the vapor chamber module applied to the high-power light-emitting diodes in natural convection. The flat-plate-type vapor chamber and the lamp-type vapor chamber are provided to solve the heat dissipation problem of the high-power light-emitting diodes. The results show that the spreading resistance and the corresponding temperature difference of the flat-plate-type vapor chamber at 30 W are lower than those of the copper plate by 34% and 4C, respectively, and are lower than those of the aluminum plate by 56% and 6C, respectively. Compared with the copper and aluminum plates, the lamp-type vapor chamber at 15 W is reduced about 8% and 12% for the total thermal resistance, respectively. In addition, it is also about 3C and 5C lower for the central wall temperature of the lighting side, respectively. This study provides a new thermal management method to solve the heat dissipation of the high-power light-emitting diodes. Furthermore, the vapor chamber can effectively lower the spreading resistance and diminish the hotspot effect.
