Experimental Investigation of Vapor Chamber Module Applied to High-Power Light-Emitting Diodes

文化大學機構典藏 CCUR > 理工學院 > 工學院 > 機械工程系暨機械工程學系數位機電研究所 > 期刊論文 > Item 987654321/20997

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题名:	Experimental Investigation of Vapor Chamber Module Applied to High-Power Light-Emitting Diodes
作者:	Chiang, YC (Chiang, Y. -C.) Huang, HS (Huang, H. -S.) Huang, CK (Huang, C. -K.) Chen, SL (Chen, S. -L.)
贡献者:	機械工程學系
关键词:	natural convection flat-plate-type vapor chamber lamp-type vapor chamber spreading resistance
日期:	2009
上传时间:	2011-12-12 12:51:33 (UTC+8)
摘要:	This article experimentally investigates the thermal performance of the vapor chamber module applied to the high-power light-emitting diodes in natural convection. The flat-plate-type vapor chamber and the lamp-type vapor chamber are provided to solve the heat dissipation problem of the high-power light-emitting diodes. The results show that the spreading resistance and the corresponding temperature difference of the flat-plate-type vapor chamber at 30 W are lower than those of the copper plate by 34% and 4C, respectively, and are lower than those of the aluminum plate by 56% and 6C, respectively. Compared with the copper and aluminum plates, the lamp-type vapor chamber at 15 W is reduced about 8% and 12% for the total thermal resistance, respectively. In addition, it is also about 3C and 5C lower for the central wall temperature of the lighting side, respectively. This study provides a new thermal management method to solve the heat dissipation of the high-power light-emitting diodes. Furthermore, the vapor chamber can effectively lower the spreading resistance and diminish the hotspot effect.
显示于类别:	[機械工程系暨機械工程學系數位機電研究所] 期刊論文

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