文化大學機構典藏 CCUR:Item 987654321/45512
English  |  正體中文  |  简体中文  |  Items with full text/Total items : 47121/50987 (92%)
Visitors : 13825878      Online Users : 308
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
Scope Tips:
  • please add "double quotation mark" for query phrases to get precise results
  • please goto advance search for comprehansive author search
  • Adv. Search
    HomeLoginUploadHelpAboutAdminister Goto mobile version


    Please use this identifier to cite or link to this item: https://irlib.pccu.edu.tw/handle/987654321/45512


    Title: Investigation on low-temperature sintered AlN nanoceramics with high thermal conductivity
    Authors: He, YL (He, Yi-Ling)
    Wu, HM (Wu, Hue-Min)
    Contributors: 物理系
    Keywords: aluminum nitride
    low-T sintering
    sintering additives
    thermal conductivity
    Date: 2019-09
    Issue Date: 2019-12-18 11:14:33 (UTC+8)
    Abstract: The aim of this research was to investigate the effect of sintering additive and relatively low-sintering temperature on the thermal conductivity of aluminum nitride nanoceramic. While using nanosized AlN powder and liquid-phase sintering additives, the various sintering processes were performed at temperatures 1400 and 1500 degrees C for several hours. In the analysis methods, thermal conductivity (K) and thermal diffusivity (alpha) were measured using thermal conductivity analyzer (Hot Disk), scanning electron microscope (SEM) was used to observe the surface morphology of the microstructure, x-ray diffraction analyzer (XRD) to analyze the grain size and crystal structure, Raman spectroscopy (Raman) emission spectrum was analyzed to identify the material microstructure and the densities of AlN specimens were measured by Archimedes method. It was found that the thermal conductivity is related to the densification of nanosize low-temperature sintered material, which can be controlled by additives and sintering temperature. With Y2O3 sintering add, the densification of AlN for low-temperature sintering increased by the factor of similar to 5% to similar to 12%, and the thermal conductivity was enhanced by 25%. The relative density observed in this research is about 78%-84%, and the thermal conductivity measured is in the range of 9-14 W/mK.
    Relation: INTERNATIONAL JOURNAL OF APPLIED CERAMIC TECHNOLOGY 卷冊: 16 期: 5 頁數: 2101-2106 特刊: SI
    Appears in Collections:[Department of Physics ] journal articles

    Files in This Item:

    File Description SizeFormat
    index.html0KbHTML176View/Open


    All items in CCUR are protected by copyright, with all rights reserved.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©   - Feedback