資料載入中.....
|
請使用永久網址來引用或連結此文件:
https://irlib.pccu.edu.tw/handle/987654321/41965
|
| 題名: | Design of long-chain branched copolyesters and manufacture as well as physical properties of their extrusion films |
| 作者: | Lai, CC (Lai, Chiu-Chun)
Yu, CT (Yu, Chun-Ta)
Chen, MH (Chen, Meng-Hsin)
Chen, HL (Chen, Hsin-Lung)
Wang, FM (Wang, Fu-Ming)
Lin, CH (Lin, Chih-Hsiang)
Liu, LC (Liu, Lung-Chang)
Chen, CM (Chen, Chien-Ming) |
| 貢獻者: | 紡織工程學系 |
| 關鍵詞: | LIQUID-CRYSTALLINE POLYMER
IN-SITU COMPOSITES
MECHANICAL-PROPERTIES
LCP
TEMPERATURE
ORIENTATION
SUBSTRATE
RHEOLOGY
BEHAVIOR |
| 日期: | 2018-01 |
| 上傳時間: | 2019-01-23 10:44:32 (UTC+8) |
| 摘要: | A long-chain branched copolyester (i.e. p-hydroxybenzoic acid (HBA)/2-hydroxy-6-naphthoic acid (HNA)/1,1,1-tris(4-hydroxyphenyl)ethane (THPE) copolyester) and its extrusion film with superior physical properties to commercial Ticona A950 and Vecstar CTZ have been manufactured by the design of appropriate prescriptions, T-Die extrusion, and thermal treatment of crystal transformation. In order to investigate the fabricating feasibility for flexible copper clad laminate (FCCL) of fourth/fifth generation long-term evolution (4G/5G LTE), we have also agglutinated lab-made copolyester extrusion film with the copper foil by hot compression. Experimental results manifest that lab-made copolyester extrusion film is a highly potential FCCL substrate of 4G/5G LTE because its thickness, dielectric constant (D-k), dielectric loss (D-f), hygroscopicity, yellowness index (YI), antistatic capability, flammability, melting temperature (T-m), coefficient of thermal expansion (CTE), and peel strength to copper foil are 50 mu m, 2.90, 0.00140, 0.04%, 2.7, 6.5 x 10(9) Omega/square UL-94 V0, 305 degrees C, 24.8 ppm/degrees C, and 29.9 lb/in, respectively. |
| 顯示於類別: | [紡織工程學系] 期刊論文
|
文件中的檔案:
| 檔案 |
描述 |
大小 | 格式 | 瀏覽次數 |
|---|
| index.html | | 0Kb | HTML | 273 | 檢視/開啟 |
|
在CCUR中所有的資料項目都受到原著作權保護.
|
