| 摘要: | 工程陶瓷有優越的機械性質，高溫下所具備的高強度與勁度、高強度-重量比、以及優異的耐腐蝕與氧化阻抗特性，符合半導體、電子、航空、汽車業之產品特性需求，產業界的應用範圍愈來愈廣；然而，由於陶瓷的硬脆特性，加工中有其困難性。
孔徑1mm以下的孔型製造稱為微鑽製程(micro drilling)。半導體產業界有百微米(100μm)以下微孔陣列的需求，本文以實驗方法規劃執行陶瓷薄板微鑽針實驗，探討微鑽針製程之鑽削參數對微孔品質特性之影響。高深徑比的微孔製作須採用分段式加工，先施以中心導孔，再以兩階段製程完成孔形製作。本研究的分析微鑽參數包括：中心導孔深度、分段長度比、切削速度、鑽針進給率、啄鑽深度等共八項，討論微鑽參數對微孔品質特性之影響。由於微孔頂面的孔徑與頂面及底面的位置度誤差直接影響著微孔陣列的功能性，本文根據田口因子水準效應分析結果，進行此三項特性之多目標問題分析，推論出最佳參數水準組合，並執行驗證實驗，確認分析結果。除了品質特性分析外，本研究應用電子顯微鏡觀察加工孔數對鑽針刀腹磨耗的影響。
本研究先後完成∅69μm與∅55μm兩組微鑽針實驗，深徑比分別為15.36、11.42。驗證實驗結果顯示：鑽針在600孔的加工程序後，孔徑的偏差量可控制在0.51~0.63μm之間；頂面與底面的單孔位置度誤差在0.29~0.98μm與1.03~1.83μm之間，本製程的有很好的掌握性，刀具也發揮了很高的使用效能。
Engineering ceramic has excellent mechanical properties, such as high strength and stiffness in high-temperature, high strength-weight ratio, and capital resistances in corrosion and oxidation, which conforms to the requirements in semiconductor, electronic, aviation, and automobile industries. Its applications are growing in widespread; however, the machining of ceramic is difficult due to the hard-brittle feature.
A hole with a diameter below 1mm made by mechanical machining is called Microdrilling. Semiconductor industry has the de has the demand of microhole pattern constructing by the holes under ∅100μm. This study conducts microdrilling experiments of a thin ceramic plate to explore the influences of drilling parameters on microhole quality characteristics machined. The fabrication of a microhole with high aspect ratio must perform by segmented machining. A center pilot hole is first made, and then uses a two-step drilling process to finish the hole. The drilling parameters analyzed include the depth of the pilot hole, length ratio of the segments, and the spindle speed, feed rate of the microdrill, depth of pecking drilling in the two-step drilling, to investigate the influences of these parameters on the quality characteristics of the microhole. Because the hole diameter of the top face and position errors of the top and bottom faces affect the functionality of the microhole pattern directly, this is a multipurpose problem by the three issues above mentioned. This study proposes a decision making method based on the factor level effects calculated to derive the optimal parametric level combination. Confirmation experiments have been done to verify the analytical results. In addition, this study also uses the SEM to inspect the flank wear of the drills for inspecting the effects of the number of drilling.
This study has finished two series of Taguchi’s microdrilling experiments. The ratios of depth-diameter are 15.36 and 11.42, respectively. Experimental results show that after 600 holes process the deviation of diameter are controlled within 0.51~0.63μm, and that of the position error of the top and bottom faces are 0.29~0.98μm and 1.03~1.83μm, respectively. The drilling parametric set derived for thin engineering ceramic plate in this study has an excellent performance and the drills have also brought into a high efficiency. |
