| 摘要: | 在科技發展快速下，外觀小重量輕厚度又薄的電子產品已是主流需求，且市場需求量也越來越大，為了要配合市場需求，傳統手工焊接電子元件技術已經被淘汰，目前的最普遍的製程為表面黏著技術(Surface Mount Technology，SMT)產品裡面PC板上的電子連接器也逐漸跟著產品越做越小，連接器上的腳位間距(Pitch)也越來越小，相對的在焊接上的穩定也越來越困難。近年來發展出錫球（Ball Grid Array，BGA）使封裝產品薄型化及縮小封裝區，且能縮短接合點距離以提高電子特性，最重要的是可達到更高的穩定性。大大了提升整個SMT製程上的良率以及產能。不過錫球缺點為後續廠商需要多花時間及成本來植入錫球。本論文提出以錫端子代替錫球之錫端子焊錫技術，此技術能節省廠商後續植入錫球的時間和成本，本研究將進行錫端子結構、平整度和溫度曲線優化參數分析與測試，來確定錫端子焊錫技術具有穩定的焊錫性。
As the technology is developing fast, the main trend of electronic products is toward small size, light weight and thin thickness a, the related market is growing as well. In order to meet market needs, the traditional manual welding technology for electronic component has been eliminated. SMT (Surface Mount Technology) is the most currently used for surface adhesive technology. The electronic connectors inside PC board of these electronic products are gradually becoming smaller, and the pitch of connector is getting narrower. Consequently, the stability of welding becomes more difficult. In recent years, the development of BGA (Ball Grid Array) solder ball technology makes packaging products thinner and narrower. BGA can shorten the junction distance with improved electrical characteristics and achieve a higher degree of stability which can greatly enhance the entire SMT process yielding and productivity. However, the disadvantages of BGA are the cost and time for the subsequent manufacturing needed to spend time to populate the solder balls. This paper proposes a tin solder plate soldering technology to instead of solder ball technology to save time and cost for soldering process. The study will carry out experiments to optimize the parameters of tin piece, tin material and temperature curve to achieve a good and stable soldering process. |
