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    請使用永久網址來引用或連結此文件: https://irlib.pccu.edu.tw/handle/987654321/29258


    題名: Mechanical and structural properties of helical and non-helical silica nanowire
    作者: Lee, Wen-Jay
    Chen, Hui-Lung
    Chen, Hsin-Tsung
    Hsieh, Jin-Yuan
    Lin, Jenn-Sen
    Ju, Shin-Pon
    Lin, Ken-Huang
    Lin, Kuan-Fu
    貢獻者: 化學系
    關鍵詞: Molecular dynamics
    Silica nanowire
    Mechanical property
    Ultrathin nanowire
    Buckle deformation
    Helical nanowire
    日期: 2014-02
    上傳時間: 2015-01-27 14:20:22 (UTC+8)
    摘要: Energetically favorable configurations of silica nanowires with helical and non-helical structures and diameters ranging from 0.4 to 1.5 nm were obtained by using the simulated annealing basing-hopping (SABH) method with penalty function in our previous work. Those nanowires include five non-helical (2MR, 2MR-2O, 3MR-3O, 4MR-4O, and 5MR-5O) and three helical structures (4MR-3f, 4MR-4f, and 4MR-5f). In this study, their mechanical properties and structural characteristics were carried out by molecular dynamics simulation, specifically the temperature and diameter effect on the tensile strength, yielding strain, and Young's modulus. Results show that diameter significantly affects Young's modulus and yielding stress, whereas the temperature mainly influences yielding strain and yielding stress. The elastic deformation allows the variation of theta(O-Si-O) to be about >16 degrees. For comparison and insight, the mechanical property and deformation behaviors in the tensile loading are compared to those in the compression loading. Buckle deformation was observed on both helical and non-helical nanowires under the compression process, demonstrating that the nanowires exhibit a higher yielding strain and Young's modulus in the compression loading than in the tensile loading. In both the tensile and compression tests, the helical angle structures of silica nanowires lower the yielding strain and only slightly affect the yielding stress and Young's modulus. (C) 2013 Elsevier B.V. All rights reserved.
    關聯: COMPUTATIONAL MATERIALS SCIENCE 卷: 82 頁碼: 165-171
    顯示於類別:[化學系所] 期刊論文

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