電子連接器和內連技術隨著電子產品不斷的高密度化和高頻率化的趨勢而面臨世紀性挑戰。21世紀為電子、生技和量子三大科技的結合。電子的連接及內連將跨越這些科技的介面發揮相容及精確的效果。基於這種需求，連接器和內連的技術和材料必須尋求突破性的出路。奈米碳管或奈半導電管的發現無疑是科技上一木突破，然而在連接器和內連方面的應用尚需加緊的研發。本文針對這一點提出幾個可行的方案和實驗結果。利用氧化鈦奈米級粉粒在紫外光下的光催化作用，將鎳或鈀離子，Ni(上標 +2)或Pd(上標 +2)，有選擇性的還原為Ni或Pd原子，還原也可以近過氫氣的化學作用來達成。選擇性的分佈金屬原子在基材上的方法不限於精密微影技術。利用氧化鋁膜形成奈米級針孔陳列分佈的模板可以說是最精密而可行的方法。將金屬原子栽植於奈米級針孔內，進而催化成長金屬一針或奈米導電管是目前最被看好的研發方向
本文沿著這種方向探討將來可以連接電子、生技和量子之間的電訊號，強調原子或分子與結晶體之間自我定位，定形，並相容成長的自然原理，希望開發成一種超高密度的電子連接器或內接中介膜，達成在高頻率傳訊下相容的電性。
Connector and interconnection technology is confronted with a great challenge of the century in the course of catching up with the trend of ever-increasing density and frequency in electronic devices and products. It is claimed that the 21st century will see the converging of three prime technologies, namely electronic, bioengineering, and quantum technology. A further challenge for electronic connectors and interconnections is to provide a compatible and reliable connectivity across the interfaces of these prime technologies.
Based on the fundamental electronic contact theory of A-spots first proposed by Ragnar Holm [1] in the early 60s, the contact resistance across a contact surface is inversely proportional to the number of a-spots, n, within the contact area. Such a theory has been considered as a conceptual value until only recently. As the need for a higher and higher contact density has become a bottleneck in today's connector design, the concept of having a contact pad with multi-micro-contacts (MMC) analogous to the concept of a-spots has become an attractive atternative for electronic connections now and in the future.
Among several methods of making MMC [2], we propose a rather noble way in this paper by which patterned contact pads with nano-size contact points on each pad can be made at relatively low cost. Taking advantage of the photo-catalytic nature of TiO2, or ZnO nanopowder having respectively a band gap of 3.0 eV and 3.2 eV, as well as having a conduction band edge potential negative to that of H2 evolution, and a valence band edge positive to that of O2 evolution. We applied the nano-powder solution of adherent on an insulating substrate to form a rough nano-scale surface. Such a substrate surface was sprayed with PdCl2 or NiCl2 solution, and then was selectively exposed to UV radiation through a shallow patterned mask. The exposed areas/pads were then covered with ”reduced” free particles of Pd or Ni which became catalytic for growth of conductive nanowires or metallic dendrites by either an electroless or electrolytic method.
Traditional connectors which are based on the spring-pin or spring-pad design have confronted a dimensional as well as an electronic limit. Contact pitches of less than 0.5 mm and contact heights or distances of less than 2mm require new concepts in design and materials. The new method and the results presented in this paper offer the industry a simple and effective answer at relatively low cost.
