晶圓測試需要藉具高密度微探針模組之探針卡做為測試機與銲墊間的接觸媒介，以測得在銲墊的電器訊號。由於IC設計的複雜性提高、銲墊間距縮小，探針針尖群形成一高密度的探針面，它的平整性對測試結果的正確性影響很大，也就是「共面度誤差」。共面度的控制是項很複雜的問題，發展微細探針的非接觸量測與共面度評估系統為探針模組製造上的重要課題。本研究應用3-D光學影像顯微鏡獲得探針模組的針尖影像資料，並發展「最小區間法」的共面度評估程式。為了達到以少量的探針量測點獲得客觀的共面度誤差，本文提出應用「逆向減化」程序，決定探針分析點；然後，全域與區域共面度分析。實驗的結果證明：間距取點法有較佳的評估精度，且只需要總探針數1/3的探針量測點即可得到分析平面的共面度誤差，大幅的降低量測成本。
Wafer testing requires a probe card with micro-probe module as a contact media between the test machine and weld pads to detect the electric signals from weld pads. Because the complexity in IC design and then arrow pitch requirement, a virtual probing surface is formed by the needle tips. Flatness of the probing surface affects the probing correctness significant; that is 'coplanarity'. To develop a non-contact measurement system for coplanarity evaluation is important in micro-probe fabrication. This study applies 3-D optical image microscope to catch needle tips image and develops evaluating program by the minimum zone criteria to calculate the surface's coplanarity. In order to achieve the goal of using the least probe measuring probes to derive an reliably evaluation, this study uses the 'data simplification' process in 'reverse engineering' to determine the measuring probes. Then, a global analysis and a local analyses are implemented. Experimental results showed that the 'span simplification' has a better evaluating accuracy than the 'factor simplification', and only one third of the total probes are required to obtain a objective coplanarity of the probing surface. The measurement cost is reduced substantially.
