| 摘要: | 印刷電路板製作時，會將基材上之全銅面咬蝕成設計所需之線路圖形，此製程我們泛稱為蝕刻製程。傳統蝕刻製程大多數是以氯化銅為主要藥水成分，但由於線路越來越精細，故以氯化銅為主之蝕刻製程，由於精度上的限制，故在BGA等較高線路精度的印刷電路板產業，不得不選用氯化鐵藥水以取代氯化銅藥水，其最大的優點是︰不只精度增加且咬蝕速度增快。
When we want to make the printed circuit board, we will take out some of the copper on the base material and form a necessary circuit figure, this step we call it a the etching process. Traditionally we use the CuCl2 chemical in the etching process, but for the more and more fine line demand, we start to Fecl3 instead of CuCl2 for the precision requirements. We have to use FeCl3 in the higher BGA area, The greatest advantage is: not only the precision increases but also the etching speed increases.
Because FeCl3 etching process is applied in circuit pattern, so the steady process will be related to the final product quality. The relevant industry is always to find the best operation parameter to control and improve the pattern precision. So this thesis describes the etching terms and the etching procedure. We also seek the main control parameters to the FeCl3 etching process main control parameters, regeneration term and the best product parameters. We hope these brief introductions can make some contribution to the printed circuit board industry.
In order to get the best production parameter, we design a series of analyzing experiments in this thesis. And we get the conclusions as below:
1. Choose the suitable controller, the parameter adjustment must include the 〔H+〕, oxidation reduction potential, specific gravity, temperature etc.
2. According the parameter to add the hydrochloric acid, oxidant and water in good time, and control chemical in appropriate temperature in order to get stable etching efficiency.
3. Take the chemical sample and analysis the chemical composition regularly in order to compare and adjust the controller parameter, prevent the big error to control the stable etching quality.
4. The industries often add shore protection agent, accelerator, moist agent, etc to increase the quality of etching. Through our analyzing that chooses the suitable additive must to get the further promote etching efficiency.
5. The Ferric Chloride etching process in fine line etching requires is excellent from this thesis. But the user must more carefully to control every process parameter to get excellent etching quality. |
