English  |  正體中文  |  简体中文  |  全文筆數/總筆數 : 47249/51115 (92%)
造訪人次 : 14140287      線上人數 : 533
RC Version 6.0 © Powered By DSPACE, MIT. Enhanced by NTU Library IR team.
搜尋範圍 查詢小技巧:
  • 您可在西文檢索詞彙前後加上"雙引號",以獲取較精準的檢索結果
  • 若欲以作者姓名搜尋,建議至進階搜尋限定作者欄位,可獲得較完整資料
  • 進階搜尋
    主頁登入上傳說明關於CCUR管理 到手機版


    請使用永久網址來引用或連結此文件: https://irlib.pccu.edu.tw/handle/987654321/2587


    題名: Electromagnetic shielding effectiveness of copper/stainless steel/polyamide fiber co-woven-knitted fabric reinforced polypropylene composites
    作者: Chen, H. C.
    Lin, J. H.
    Lee, K. C.
    貢獻者: 紡工系
    關鍵詞: electrical properties
    knitting
    thermoplastic resin
    weaving
    electromagnetic shielding effectiveness (EMSE)
    electrostatic discharge (ESD)
    日期: 2008
    上傳時間: 2009-11-06 15:40:36 (UTC+8)
    摘要: Copper wire and polyamide filament were used as the core yarn, and stainless steel wire was used as the wrapping yarn to fabricate the loop yarns for knitting structure. The nonwoven selvedge served as the core yarn, and the conducting wire was used as the wrapping yarn, to fabricate the weft-inlaid yarn. The rotor twister successfully fabricated a series of conductive hybrid yarns (CHYs). The co-woven-knitted machine successfully fabricated the conductive co-woven-knitted fabrics (CWKFs) with various CHYs. The conducting materials of the hybrid yarn were copper wire and stainless steel wire, taken as the wrapping and core yarn, respectively. The conductive co-woven-knitted fabrics were laminated with various angles in four and six layers and then heat pressed to 2 and 3 mm in thickness. This study investigated the surface resistivity, electromagnetic shielding effectiveness (EMSE) and electrostatic discharge (ESD) attenuation percentage of the co-woven-knitted fabrics and CWKFs reinforced composites.
    關聯: JOURNAL OF REINFORCED PLASTICS AND COMPOSITES Volume: 27 Issue: 2 Pages: 187-204
    顯示於類別:[紡織工程學系] 期刊論文

    文件中的檔案:

    檔案 描述 大小格式瀏覽次數
    index.html0KbText1050檢視/開啟


    在CCUR中所有的資料項目都受到原著作權保護.


    DSpace Software Copyright © 2002-2004  MIT &  Hewlett-Packard  /   Enhanced by   NTU Library IR team Copyright ©  2006-2025  - 回饋