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    請使用永久網址來引用或連結此文件: https://irlib.pccu.edu.tw/handle/987654321/25850


    題名: 自動化機台控制印刷電路板之電磁干擾分析與優化
    The electromagnetic interference analysis and improvement for automatic control PCB board.
    作者: 黃家峰
    Huang, Gu-Feng
    貢獻者: 機械工程學系數位機電碩士班
    關鍵詞: 印刷電路板
    電磁干擾(EMI)
    CST
    PCB
    EMC
    日期: 2013-06
    上傳時間: 2013-10-31 14:13:11 (UTC+8)
    摘要: 現今產品生產由從前的人力手工生產轉變為自動化機械生產,產品週期變化快速,自行研發自動化生產機台是必要的趨勢。自行研發生產機台除了要達到大量且快速生產外,還要小心機台整體問題,如自動化機台內部電路與配線問題、電磁干擾(Electromagnetic Interference, EMI)的問題、電子元件相容問題等,其中電磁相容性問題尤需要注意。
    本研究針對自動化機台內部控制印刷電路板之電磁干擾問題,利用Computer Simulation Technology (CST) Studio Suite電磁模擬軟體進行電路板線路之電磁干擾分析,首先使用參考文獻的案例與分析結果來驗證本研究的CST模擬模型與分析結果,比較結果相吻合,本研究也進行PCB板的電磁干擾數據量測,再將實測數據與模擬結果數據比對,比較顯示實測數據與模擬分析結果趨勢相近,本研究利用與文獻結果比對與實測數據比較來確定本模擬分析之精確性。最後本研究進行PCB板的防電磁干擾優化分析,針對PCB板的板材介電常數、PCB板厚度、線路距離、接地層與訊號層距離、走線設計、疊層設計及線路形狀等參數對PCB板電磁干擾影響進行探討,並針對以上參數提出新的優化設計電路,並比較原始與優化PCB板防電磁干擾之特性。
    Due to the transition from the human hand production to the current production by automation machine, the product life cycle changes quickly and researched trends in automation machine is necessary today. In addition to large and rapid production, the issues of internal circuits and wiring, electromagnetic interference, electronic component compatibility on automated machine need to be aware, especially electromagnetic interference problems.
    This study establishes the capability of electromagnetic compatibility analysis for printed circuit board by Computer Simulation Technology (CST) studio suite of high-frequency electromagnetic simulation software.
    First, the study case and results of reference paper are used to verify the present CST model and its results. The comparison between the reference paper and present analysis shows that results are consistent. In this study, the electromagnetic compatibility data of PCB was measured and compared with the simulated data. It is shown that the CAE simulates the similar trend with the experimental result. The accuracy of the present study is verified by reference data and experimental data.
    Finally, the electromagnetic interference optimization analysis is conducted for PCB board. The parameters of dielectric constant, board thickness, line distance, and the distance between grounding layer and signal layer, tracing design, lamination design and the line shape of PCB board on the electromagnetic interference are verified and studied. The new design of optimization circuit is proposed and compared with the original PCB board.
    顯示於類別:[機械工程系暨機械工程學系數位機電研究所] 博碩士論文

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