Electrical routing and integrated packaging on bio-compatible flexible substrates have been designed and fabricated. The realized packaging method can integrate electrical circuits, stationary components and moving components on flexible substrates. Chips can be embedded on flexible packages and work on a non-planar surface. In this article, the package specimens are tested and simulated in tensile, bending and sealing experiments. In addition, the density and Young's Modulus of polydimethylsiloxane (PDMS) is discussed with various curing conditions. A prototype made by the packaging process shows its functional system integration. This flexible packaging technology can be applied to communication or sensing products when flexibility is required.
