| 摘要: | 傳統電子連接器的設計主要方向為端子的插入力、拔出力、保持力等機械結構。為了達至機械結構的要求，通常會在端子的外型、折彎角度、材料厚度、寬度進行設計變更。
但高頻電子連接器不僅於扮演銜接的零件而已，還必須能快速且大量的傳遞數位訊號，其設計除符合機械結構之需求外，還必須滿足高頻之電性要求。
本研究將運用CST高頻電磁模擬與Abaqus有限元素結構分析軟體進行電子連接器結構與高頻電磁耦合分析及優化設計，交叉模擬探討電子連接器端子機械結構與高頻電磁特性之間的敏感性，及如何在限定的尺寸架構下設計出最佳化的高頻電子連接器。本研究同時進行測試治具的開發，為提升高頻電氣特性量測結果的準確性，於相關測試治具設計時需將治具所包含高頻寄生效應降到最低。
The traditional electronic connector design is focused on the pin insertion force, pull-out force and retention force etc. mechanical structural performance. In order to achieve the mechanical structural requirements, it is usually to undertake design changes on the pin's exterior, bend angle, material thickness, width etc.
Regarding the high-frequency electronic connectors, they are not only to serve as the connecting parts but also to deliver a large amount of digital signals quickly. Therefore, the design of high-frequency electronic connector needs to comply with both the mechanical structural requirements and the high frequency of electrical requirements.
This study will use the CST high-frequency electromagnetic simulation and the Abaqus FEA structural analysis to undertake structural and electromagnetic coupled analysis and optimization for high frequency connectors. In addition, the cross simulation will be conducted to investigate sensitivity between mechanical structure and high-frequency electromagnetic to design and optimize high-frequency electronic connectors under the size limitation. Additionally, this research carries on tests the fixture the development for high frequency connectors. |
